Team R&D
The R & D department of Everwide dapat dengan mudah dibagi menjadi empat tim.

Tim pertama
UV Cureable Resin yang didedikasikan untuk menghasilkan produk-produk elektronik untuk: 1. Penguatan poin kabel 2. Kunci PC + Karet silikon sendi keypad 3. Ponsel bergulir resin 4. BEF resin film moulding 5. Versi lunak dilapisi dengan isolasi resin 6 Lem yang larut dalam air dalam dicelup wafer.

Tim Kedua
The research and development topics focus on UV Cureable Resin, and the products can be applied to glass art, furniture joint, waterproof adhesive, plastic art, gift joint, PET&PVC film adhesive, coating, formimg, 3C products percise speaker assembly materials, solar cell module encapsulation, LCD panel clip adhesive and LCD screen sealing, and various types of adhesive for molding in the IMD film, etc.

Tim Ketiga
Focus on applications of one component or tow component epoxy resin, including OLED display device encapsulation, C-MOS &CCD modules, LED chip encapsulation and casting module, COB process encapsulation of circuit board, adhesive for temporarily fixing parts of SMT dual panel process , BGA & CSP& flip-chip for underfill, precise assembly of transceiver core components, fiber connections, signal expansion in optics, components in optical transceivers assembly, high heat applications with two component & one component & reactive thermal grease, and non-reactive thermal grease, waterproof encapsulation for automotive signal lamps, and overall assembly of bicycles.

Tim Keempat
Resin epoksi yang didedikasikan untuk pengembangan bahan komposit, pot listrik berat, aplikasi metalurgi serbuk. Produksinya termasuk serat karbon, resin cetakan serat gelas (resin diresapi, resin pembungkus, resin lay-up tangan, resin RTM), komponen insulasi pengecoran motor besar, resin molding kompresi kompresi resin magnetik dan material komposit resin busa dan pot lainnya, enkapsulasi, dan adhesi resin epoksi.